Global FOPLP Market Set to Reach USD 6.8 Billion by 2032 | Rapid Growth Driven by Semiconductor Packaging Innovations

According to the latest market analysis by DataIntelo, the global FOPLP Market (Fan-Out Panel Level Packaging) is poised to grow from USD 1.9 billion in 2023 to an estimated USD 6.8 billion by 2032, expanding at a robust CAGR of 15.2% during the forecast period.